2025
-
Impact of Fomes fomentarius growth on the mechanical properties of material extrusion additively manufactured PLA and PLA/Hemp biopolymers.
Panjalipoursangari N, Ou Y, Schmidt B, Müller WH and Völlmecke C. Impact of Fomes fomentarius growth on the mechanical properties of material extrusion additively manufactured PLA and PLA/Hemp biopolymers. Fungal Biol Biotechnol. (2025); 8, 2(1):14. DOI: 10.1186/s40694-025-00205-9
-
Structural, mechanical, and genetic insights into heat-pressed fomes fomentarius mycelium from solid-state and liquid cultivations.
Chen H, Klemm S, Scoppola E, Schmidt B, Wu Y, Fleck C, Gurlo A, Meyer V, Freidank-Pohl C and Simon U. Structural, mechanical, and genetic insights into heat-pressed fomes fomentarius mycelium from solid-state and liquid cultivations. Adv. Sustainable Syst. (2025); e00484. DOI: 10.1002/adsu.202500484
-
Back to the Roots! In The Divide Between Humanities and Science: Why it Matters and How it can be Repaired.
Meyer V. Back to the Roots! In The Divide Between Humanities and Science: Why it Matters and How it can be Repaired. Edited by Brusca C. Ethics International Press Ltd, UK (2025); Print Book ISBN: 978-1-83711-013-1, eBook ISBN: 978-1-83711-014-8
-
Uncovering the transcriptional landscape of Fomes fomentarius during fungal-based material production through gene co-expression network analysis.
Cairns T, Freidank-Pohl C, Birke AS, Regner C, Jung S and Meyer V. Uncovering the transcriptional landscape of Fomes fomentarius during fungal-based material production through gene co-expression network analysis. Fungal Biol Biotechnol 12, 1 (2025). DOI: 10.1186/s40694-024-00192-3
-
Extrusion-based additive manufacturing of complex three-dimensional ultra-lightweight materials using the basidiomycete Fomes fomentarius.
Chen H, Schmidt B, Gennett A, Kamm PH, Gurlo A, Meyer V and Simon U. Extrusion-based additive manufacturing of complex three-dimensional ultra-lightweight materials using the basidiomycete Fomes fomentarius. Materials Advances (2025). DOI: 10.1039/D5MA00320B.