2024

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Operate with Fungi.
Meyer V, Schäffner W, Schmidt B, Hoberg F, Stelzer L, Freidank-Pohl C, Miodragovic N, Almpani-Lekka D, Weinhold M, Goehler A, Philippi N, Ross P, Göngrich E, Wilhelm N, Garcia Pérez M, Ficht J, Bredekamp H, Meyer V (Editor), Schäffner W (Editor). Operate with Fungi. Universitätsverlag der TU Berlin (2024); ISBN 978-3-98781-004-6 (print), DOI: 10.14279/depositonce-21528
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Tailoring the Mechanical Properties of Fungal Mycelium Mats with Material Extrusion Additive Manufacturing of PHBH and PLA Biopolymers.
Chen H, Klemm S, Dönitz A, Ou Y, Schmidt B, Fleck C, Simon U, Völlmecke C. Tailoring the Mechanical Properties of Fungal Mycelium Mats with Material Extrusion Additive Manufacturing of PHBH and PLA Biopolymers. ACS Omega Article ASAP (2024). DOI: 10.1021/acsomega.4c07661
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Border crossings and connections.
Weinhold, M. Border crossings and connections. Fungal Biol Biotechnol (2024); 11(12). DOI: 10.1186/s40694-024-00182-5
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Hierarchical structure and chemical composition of complementary segments of the fruiting bodies of Fomes fomentarius fungi fine-tune the compressive properties.
Klemm S, Freidank-Pohl C, Bauer L, Mantouvalou I, Simon U, Fleck C. Hierarchical structure and chemical composition of complementary segments of the fruiting bodies of Fomes fomentarius fungi fine-tune the compressive properties. PLoS One (2024); 19(6). DOI: 10.1371/journal.pone.0304614
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Patent landscape analysis for materials based on fungal mycelium: a guidance report on how to interpret the current patent situation.
Meyer V, Mengel S. Patent landscape analysis for materials based on fungal mycelium: a guidance report on how to interpret the current patent situation. Fungal Biol Biotechnol (2024); 11(11). DOI: 10.1186/s40694-024-00177-2
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Investigation of the interface of fungal mycelium composite building materials by means of low-vacuum scanning electron microscopy.
Lehmann C, Schmidt B, Stephan D, Meyer V. Investigation of the interface of fungal mycelium composite building materials by means of low-vacuum scanning electron microscopy. Journal of Microscopy (2024); 1–12. DOI: 10.1111/jmi.13292